HPE Intel Xeon E5430 processor 2.66 GHz 12 MB L2
- Intel Xeon Processor E5430 (12M Cache
- 2.66 GHz
- 1333 MHz FSB)
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Description
HPE Intel Xeon E5430. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: LGA 771 (Socket J), Processor lithography: 45 nm. Market segment: Server, Number of Processing Die Transistors: 820 M, Processing Die size: 214 mm². Weight: 1.36 kg, Processor package size: 37.5 mm. Intel® Virtualization Technology (Intel® VT): VT-x, Dimensions (WxDxH): 168.4 x 165.1 x 177.8 mm
Performance. Efficiency. Agility.
Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel® Core™ microarchitecture, optimized for low-power, dual-core, 64-bit computing.
The Dual-Core Intel Xeon processor 5100 series is ideal for intense computing environments, 32-bit and 64-bit business-critical applications and high-end workstations. Combined with the Intel® 5000 chipset family and Fully Buffered DIMM (FBDIMM) technology, the new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 3 times the performance and 3.5 times the performance/watt of previous-generation single-core Intel® Xeon® processors. The new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 2.25 times the performance and 2.35 times the performance/watt of previous-generation dual-core Intel Xeon processors.
The Dual-Core Intel Xeon processor 5100 series is compatible with Intel® 5000P, 5000V and 5000X series of chipsets. Server boards based on these chipsets are optimized for dual core with advanced platform features of Dual Independent Bus and Fully Buffered DIMM memory technology offering up to 4X and 3X available bandwidth of current generation platforms. Improved I/O performance is possible with PCI Express* and the option of Intel I/O Acceleration Technology.
Dual-core processing
Significant performance headroom, especially for multi-threaded applications, helps boost system utilization through virtualization and application responsiveness.
Intel® Core™ microarchitecture
Better performance on multiple application types and user environments at a substantially reduce power envelope.
Majority of SKUs at 65W
Significantly lower power (compared to previous generation) helps improve data center density and power/thermal operating costs.
Ultra-dense, ultra low-power SKUs at 40W
Low-voltage SKU available at reduced power envelopes will deliver even higher performance per watt — helps reduce power/thermal operating costs and improve data center density.
4 MB shared L2 cache
Increases efficiency of L2 cache-to-processor data transfers, maximizing main memory to processor bandwidth and reducing latency.
Entire L2 cache can be allocated to one core.
1066 and 1333 MHz system bus
Faster system bus speeds than previous generations for increased throughput.
Intel® Virtualization Technology
New processor hardware enhancements that support software-based virtualization, enabling migration of more environments — including 64-bit OSs and applications — to virtual environments.
Intel® Extended Memory 64 Technology (Intel® EM64T)
Flexibility for 64-bit and 32-bit applications and operating systems.
Enhanced Intel® Speedstep™ Technology
Helps reduce average system power consumption and potentially improves system acoustics.
Specifications
| Other features | |
|---|---|
| Dimensions (WxDxH) | 168.4 x 165.1 x 177.8 mm |
| Intel® Virtualization Technology (Intel® VT) | VT-x |
| Weight & dimensions | |
| Processor package size | 37.5 mm |
| Weight | 1.36 kg |
| Operational conditions | |
| Tcase | 67 °C |
| Processor special features | |
| Intel VT-x with Extended Page Tables (EPT) | Y |
| Intel Demand Based Switching | Y |
| Intel Virtualization Technology (VT-x) | Y |
| Enhanced Intel SpeedStep Technology | Y |
| Features | |
| Market segment | Server |
| Embedded options available | N |
| Processing Die size | 214 mm² |
| Number of Processing Die Transistors | 820 M |
| Execute Disable Bit | Y |
| Idle States | Y |
| Thermal Monitoring Technologies | Y |
| Power | |
| VID Voltage Range | 0.85 - 1.35 V |
| Thermal Design Power (TDP) | 80 W |
| Graphics | |
| On-board graphics adapter | N |
| Processor | |
| FSB Parity | Y |
| L2 cache speed | 2.66 GHz |
| Compatible chipsets | Intel® 5000P, Intel® 5000V, Intel® 5000X, Intel® 5100, Intel® 5400 |
| Processor cache type | L2 |
| Processor cache | 12 MB |
| Processor operating modes | 64-bit |
| Processor threads | 4 |
| Processor model | E5430 |
| Processor front side bus | 1333 MHz |
| Box | N |
| Processor lithography | 45 nm |
| Component for | Server/workstation |
| Processor socket | LGA 771 (Socket J) |
| Processor cores | 4 |
| Processor base frequency | 2.66 GHz |
| Processor family | Intel® Xeon® 5000 Sequence |
