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Description
HPE Intel Xeon 2.7GHz. Processor family: Intel® Xeon®, Processor socket: Socket 603, Processor lithography: 130 nm. Market segment: Server, Number of Processing Die Transistors: 82 M, Processing Die size: 555 mm²
Maximize Performance. Minimize Power. Automatically.
As data centers reach the upper limits of their power and cooling capacity, efficiency has become the focus of extending the life of existing data centers and designing new ones. As part of these efforts, IT needs to refresh existing infrastructure with standard enterprise servers that deliver more performance and scalability, more efficiently.
Specifications
Operational conditions | |
---|---|
Tcase | 70 °C |
Features | |
Market segment | Server |
Processing Die size | 555 mm² |
Number of Processing Die Transistors | 82 M |
Power | |
Thermal Design Power (TDP) | 80 W |
Graphics | |
On-board graphics adapter | No |
Processor | |
Processor cache type | L2 |
Processor cache | 2 MB |
Processor operating modes | 32-bit |
Processor front side bus | 400 MHz |
Processor lithography | 130 nm |
Component for | Server/workstation |
Processor socket | Socket 603 |
Processor cores | 1 |
Processor base frequency | 2.7 GHz |
Processor family | Intel® Xeon® |